| |
产品领域：通信系统背板
层数：52L四阶HDI 板厚6.2mm；
工艺结构：FR-4＋TG150、***小孔0.10mm、铜厚1OZ、线宽线距5/4mil、介质常数4.20、阻抗Ω±10%
表面处理：电金2u"
Product area: communication system backplane
Number of layers: 52L fourth-order HDI plate thickness 6.2mm;
Process structure: FR-4+TG150, minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 5/4mil, dielectric constant 4.20, impedance Ω±10%
Surface treatment: electric gold 2u"
| 规格： |
285*268 |
| 数量： |
260000 |
包装：真空包装+防潮珠 |
| 日期： |
2019-09-07 |
|
|
